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        Thermal & Reliability Study on High Current Thermal Vias & Output Pins應用指南

        文件來源:SynQor
        文件類型:pdf
        更新時間:2011-02-18
        文件大?。?84K
        This application note addresses concerns raised with regards to pin and board heating when high currents (>60A) are driven through thermally relieved plated through hole (PTH) vias. Detailed thermal analysis will show that internal heat generation and resulting temperature rise of the power converter and load board is minimal when using a single thermally relieved via.
        本文鏈接:http://www.joehorizon.com/power-dl/521
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